Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

In this paper, interfacial reaction between diamond grit and Sn-6Ti alloy was systematically studied at brazing temperatures from 600 to 1030 degrees C. A thin and uniform layer of scallop-like nano-sized TiC grains was formed after brazing for 30 min at 600 degrees C, and interfacial TiC grains subsequently coarsened as brazing temperature increased to 740 and 880 degrees C. Strip-like columnar TiC grains in a bilayer structure was further grown as brazing temperature increased to 930 degrees C. After brazing at 1030 degrees C, a dense layer of columnar TiC grains were formed. Based on the TEM micrographs of interfacial TiC, the formation and evolution of the growth morphologies of interfacial TiC was believed to be controlled by the diffusion of C flux from diamond grits, which is dependent on the brazing temperatures.