Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

被引：42

作者：

Miyajima, Yoji ^{[1
]}

Okubo, Satoshi ^{[1
]}

Abe, Hirold ^{[1
]}

Okumura, Hiroki ^{[1
]}

Fujii, Toshiyuki ^{[2
]}

Onaka, Susumu ^{[1
]}

Kato, Masaharu ^{[1
]}

机构：

[1] Tokyo Inst Technol, Dept Mat Sci & Engn, Grad Sch Sci & Engn, Midori Ku, Yokohama, Kanagawa 2268502, Japan

[2] Tokyo Inst Technol, Grad Sch Engn, Dept Met & Ceram Sci, Meguro Ku, Tokyo 1528552, Japan

来源：

MATERIALS CHARACTERIZATION | 2015年 / 104卷

关键词：

Ultrafine grain; Dislocation density; Dislocation structure; Grain size; STEM; TEM; Cu; SEVERE PLASTIC-DEFORMATION; ARB PROCESS; METALS;

D O I：

10.1016/j.matchar.2015.04.009

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The dislocation density of pure copper fabricated by two severe plastic deformation (SPD) processes, i.e., accumulative roll bonding and equal-channel angular pressing, was evaluated using scanning transmission electron microscopy/transmission electron microscopy observations. The dislocation density drastically increased from similar to 10(13) m(-2) to about 5 x 10(14) m(-2), and then saturated, for both SPD processes. (C) 2015 Elsevier Inc All rights reserved.

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页码：101 / 106

页数：6

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