Development of an X-ray imaging system with SOI pixel detectors

被引:15
作者
Nishimura, Ryutaro [1 ]
Arai, Yasuo [2 ]
Miyoshi, Toshinobu [2 ]
Hirano, Keiichi [3 ]
Kishimoto, Shunji [3 ]
Hashimoto, Ryo [3 ]
机构
[1] SOKENDAI, Sch High Energy Accelerator Sci, Oho 1-1, Tsukuba, Ibaraki 3050801, Japan
[2] High Energy Accelerator Res Org KEK IPNS, Inst Particle & Nucl Studies, Oho 1-1, Tsukuba, Ibaraki 3050801, Japan
[3] High Energy Accelerator Res Org KEK IMSS, Inst Mat Struct Sci, Oho 1-1, Tsukuba, Ibaraki 3050801, Japan
关键词
SOI; Pixel; Detector; DAQ; 3D CT; X-ray imaging;
D O I
10.1016/j.nima.2016.04.036
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
An X-ray imaging system employing pixel sensors in silicon-on-insulator technology is currently under development. The system consists of an SOI pixel detector (INTPIX4) and a DAQ system based on a multipurpose readout board (SEABAS2). To correct a bottleneck in the total throughput of the DAQ of the first prototype, parallel processing of the data taking and storing processes and a FIFO buffer were implemented for the new DAQ release. Due to these upgrades, the DAQ throughput was improved from 6 Hz (41 Mbps) to 90 Hz (613 Mbps). The first X-ray imaging system with the new DAQ software release was tested using 33.3 keV and 9.5 keV mono X-rays for three-dimensional computerized tomography. The results of these tests are presented. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:49 / 54
页数:6
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