The effect of additives on the pulsed electrodeposition of copper

被引：16
作者：
Mohan, S [1 ]
Raj, V [1 ]
机构：
[1] Cent Electrochem Res Inst, Karaikkudi 630006, Tamil Nadu, India
来源：
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2005年 / 83卷 / 04期
关键词：
pulse plating; copper; duty cycle; frequency; current efficiency; throwing power;
D O I：
10.1179/002029605X61595
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The pulsed electrodepostion of copper has been systematically investigated from a copper sulphate bath. Pulse duty cycles of 5-80%, at frequencies from 10 to 100 Hz with current densities ranging from 2.5 to 7.5 A dm(-2) were employed. The influences of pulsed current duty cycle, peak current density and frequency on the thickness and hardness of the copper deposit, current efficiency and throwing power of the plating process were studied. The effect of additives, polyethylene glycol and di-sodium EDTA on the properties of deposit were investigated.
引用
收藏
页码：194 / 198
页数：5
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