Wire bonded interdigital capacitor

被引：48

作者：

Casares-Miranda, FP ^{[1
]}

Otero, P ^{[1
]}

Márquez-Segura, E ^{[1
]}

Camacho-Peñalosa, C ^{[1
]}

机构：

[1] Univ Malaga, ETS Ingn Telecomunicac, Dept Ingn Comunicac, Malaga 29071, Spain

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2005年 / 15卷 / 10期

关键词：

interdigital capacitor (IDC); microwave passive circuits; wire bonded interdigital capacitor (WBIDC); wire bonding;

D O I：

10.1109/LMWC.2005.856835

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Interdigital capacitors (IDCs) are convenient capacitance devices in microstrip circuits, even if only low capacitance values can be achieved. Nevertheless, undesired resonances degrade their performance when frequency increases. Short circuits across the end of alternate fingers of the IDC improve its high frequency response by eliminating that drawback. Simulated and measured results are presented.

引用

页码：700 / 702

页数：3

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