Effects of NH4F on the deposition rate and buffering capability of electroless Ni-P plating solution

被引：21

作者：

Ying, H. G. ^{[1
]}

Yan, M. ^{[1
]}

Ma, T. Y. ^{[1
]}

Wu, J. M. ^{[1
]}

Yu, L. Q. ^{[1
]}

机构：

[1] Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China

来源：

SURFACE & COATINGS TECHNOLOGY | 2007年 / 202卷 / 02期

基金：

高等学校博士学科点专项科研基金; 中国国家自然科学基金;

关键词：

ammonium fluoride; electroless Ni-P plating; buffering capability;

D O I：

10.1016/j.surfcoat.2007.05.025

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The deposition rate and buffering capability of alkaline electroless Ni-P plating solution containing ammonium fluoride (NH4F) have been investigated. When the NH4F concentration is below 10 g L-1, the deposition rate is improved with the addition of NH4F, reaching the maximum value at 2 g L-1. The buffering capability of solutions is found to be improved with increasing NH4F concentration. Due to the improvement of buffering capability, refined and compact Ni-P coatings with homogeneous elemental distribution of P have been achieved. Therefore, both the corrosion resistance and microhardness of Ni-P coatings are significantly improved. The mechanism of NH4F improving the deposition rate and the buffering capability is discussed. (c) 2007 Published by Elsevier B.V.

引用

页码：217 / 221

页数：5

共 16 条

[1]

[Anonymous], PLATING

[2] Electroless nickel plating of magnesium [J].

Fairweather, WA .

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1997, 75 :113-117

[3] First stages of platinum electroless deposition on silicon(100) from hydrogen fluoride solutions studied by AFM [J].

Gorostiza, P ;

Servat, J ;

Morante, JR ;

Sanz, F .

THIN SOLID FILMS, 1996, 275 (1-2) :12-17

[4] Electroless Ni-P plating on AZ91D magnesium alloy from a sulfate solution [J].

Gu, CD ;

Lian, JS ;

Li, GY ;

Niu, LY ;

Jiang, ZH .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 391 (1-2) :104-109

[5]

Gutzeit G., 1959, PLATING, V46, P1158

[6]

HUA TW, 2005, PRINCIPLES BASIC CHE, P85

[7] Studies of the porosity in electroless nickel deposits on magnesium alloy [J].

Li, JZ ;

Tian, YW ;

Huang, ZQ ;

Zhang, X .

APPLIED SURFACE SCIENCE, 2006, 252 (08) :2839-2846

[8] Electroless nickel plating from acid bath [J].

Malecki, A ;

Micek-Ilnicka, A .

SURFACE & COATINGS TECHNOLOGY, 2000, 123 (01) :72-77

[9]

Narayanamurthy H., 1998, MET FINISH, V96, P10

[10] Nickel electroless deposition process on chemically pretreated Si(100) wafers in aqueous alkaline solution [J].

Niwa, D ;

Takano, N ;

Yamada, T ;

Osaka, T .

ELECTROCHIMICA ACTA, 2003, 48 (09) :1295-1300

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