Single event effect characterization of high density commercial NAND and NOR nonvolatile flash memories

被引:62
作者
Irom, Farokh [1 ]
Nguyen, Duc N. [1 ]
机构
[1] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA
关键词
catastrophic; destructive; dielectric gate rupture; micro-dose; nonvolatile memory;
D O I
10.1109/TNS.2007.909984
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Heavy ion single-event measurements on a variety of high density commercial NAND and NOR flash memories were reported. Three SEE phenomena were investigated: SEUs, SEFIs, and catastrophic loss of ability to erase and write to the device. Although for all devices under test SEUs and SEFIs were observed, these commercial high densities devices appear to be much less susceptible than typical flash devices that have been tested lately. A new high current phenomenon in the high density NAND flash memories and charge pump failure in the NOR flash memory are discussed.
引用
收藏
页码:2547 / 2553
页数:7
相关论文
共 24 条
[21]   Single-event upset in flash memories [J].
Schwartz, HR ;
Nichols, DK ;
Johnston, AH .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1997, 44 (06) :2315-2324
[22]   Single event gate rupture in thin gate oxides [J].
Sexton, FW ;
Fleetwood, DM ;
Shaneyfelt, MR ;
Dodd, PE ;
Hash, GL .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1997, 44 (06) :2345-2352
[23]  
SWIFT G, COMMUNICATION
[24]   A NEW CLASS OF SINGLE EVENT HARD ERRORS [J].
SWIFT, GM ;
PADGETT, DJ ;
JOHNSTON, AH .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1994, 41 (06) :2043-2048