Microscopic analysis of the degradation mechanism of gallium arsenide metal-semiconductor field-effect transistor

被引:4
|
作者
Sasaki, H
Hayashi, K
Fujioka, T
Mizuguchi, K
Yea, B
Osaki, T
Sugahara, K
Konishi, R
机构
[1] Mitsubishi Elect Corp, Semicond Grp, Itami, Hyogo 664, Japan
[2] Tottori Univ, Fac Engn, Tottori 680, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1998年 / 37卷 / 08期
关键词
GaAs MESFET; surface states; degradation; reliability; hot carrier; impact ionization; thermionic field emission; drain current transient; Raman scattering; X-TEM; OBIC; light emission; electroluminescence;
D O I
10.1143/JJAP.37.4301
中图分类号
O59 [应用物理学];
学科分类号
摘要
The microscopic degradation mechanism of the recess surface of GaAs metal- semiconductor field-effect transistor (MESFET) after a long duration aging is analyzed using a transmission electron microscope (TEM), Raman scattering and several other analytical methods. Crystallographic arsenic (As) and amorphous gallium (Ga) precipitated after the aging test. Raman scattering during device operation indicates that the temperature of the drain side is higher than that of the source side. Light emission by hot carriers is observed at the drain side of the device during operation. The degradation of the device is accelerated by the hut carriers generated by a thermionic field emission at the high-temperature drain side.
引用
收藏
页码:4301 / 4305
页数:5
相关论文
共 50 条
  • [1] Microscopic analysis of the degradation mechanism of gallium arsenide metal-semiconductor field-effect transistor
    Mitsubishi Electric Corp, Hyogo, Japan
    Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap, 8 (4301-4305):
  • [2] Operating mechanism of the organic metal-semiconductor field-effect transistor (OMESFET)
    Kim, C. H.
    Tondelier, D.
    Geffroy, B.
    Bonnassieux, Y.
    Horowitz, G.
    EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2011, 56 (03): : 34105 - p1
  • [3] A PLANAR GAAS METAL-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR
    DENG, XC
    CHINESE PHYSICS, 1981, 1 (01): : 232 - 238
  • [4] GALLIUM-ARSENIDE METAL FIELD-EFFECT TRANSISTOR RELIABILITY STUDY
    MEIGNANT, D
    ACTA ELECTRONICA, 1980, 23 (02): : 151 - 164
  • [5] Sulfur passivation of GaAs metal-semiconductor field-effect transistor
    Dong, Y
    Ding, XM
    Hou, XY
    Li, Y
    Li, XB
    APPLIED PHYSICS LETTERS, 2000, 77 (23) : 3839 - 3841
  • [6] GAAS METAL-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR, MICROWAVE TRANSISTOR WITH LITTLE NOISE
    KNIEPKAMP, H
    SIEMENS ZEITSCHRIFT, 1976, 50 (11): : 736 - 741
  • [7] POWER GALLIUM-ARSENIDE METAL FIELD-EFFECT TRANSISTOR - DESIGN AND TECHNOLOGY
    BAUDET, P
    ACTA ELECTRONICA, 1980, 23 (02): : 119 - 125
  • [9] Self-Aligned Organic Metal-Semiconductor Field-Effect Transistor
    Lo, Yi-Chen
    Cheng, Xing
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (02) : 1323 - 1330
  • [10] NEGATIVE TRANSCONDUCTANCE IN A RESISTIVE GATE METAL-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR
    YIN, Y
    COOPER, JA
    NEUDECK, PG
    BALZAN, ML
    GEISSBERGER, AE
    APPLIED PHYSICS LETTERS, 1989, 54 (19) : 1884 - 1886