The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al2O 3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.