Electrical measurement, modeling and analysis for high-speed and high-density IC package design

Electrical design of integrated circuit (IC) packages plays an essential role in developing high-speed and high-density devices. IC package electrical design requires knowledge of accurate-frequency dependent electrical parasitics for package interconnections. In this paper, an efficient and accurate electrical modeling method for package interconnections tvas developed for high- speed and high- density IC package design. This method used a commercial 3D structure electromagnetic field simulator for extracting S- parameters fi-om the package physical models and a linear circuit simulator for modeling inductance (L) and capacitance (C) parameters. In ol-der to demonstrate the modeling method developed in this paper, the S-parameters were extracted from a two-metal flex based ball grid an-ay (BGA) package and then L and C parameters were fit to the simulated S-parameters. The model was verified with the measured S-parameters by network analyzer-bused measurement system and the L and C parameters modeled fi-om the measured S-parameters. The simulation results show excellent agreement with measurement The method proposed in this paper provides a complete environment for the electrical modeling of IC packages. This electrical modeling,method, based on the electromagnetic field simulator and linear circuit simulator, can be used for high-speed and high-density IC package design to eliminate traditional "cut-and-try" prototyping, ultimately reducing development costs and speeding time-to-market.