Electrical Conductivity of Air-curable Electrically Conductive Adhesives Containing Copper Fillers Using Mixed Surfactants

被引：0

作者：

Matsunami, Yukari ^{[1
]}

Otajima, Daisuke ^{[1
]}

Kawarai, Kenta ^{[2
]}

Saito, Yuki ^{[2
]}

Inoue, Masahiro ^{[2
]}

机构：

[1] Gunma Univ, Sch Sci & Technol, Ota, Japan

[2] Gunma Univ, Grad Sch Sci & Technol, Ota, Japan

来源：

2021 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2021年

关键词：

electrically conductive adhesives; copper; surfactants; curing; electrical conductivity;

D O I：

10.1109/ICSJ52620.2021.9648905

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Effect of surfactants on electrical conductivity of copper-filled adhesives composed of resol-type phenolic resin was investigated. The adhesives containing copper fillers treated with oleic acid and mono ethanol amine showed relatively low electrical resisivities after curing in air. Moreover, electrical conductivity of the adhesives can be further enhanced by simultaneously using these surfactants for surface treatment of the fillers. Magnitude of the enhancement of electrical conductivity by the surfactant mixtures was different depending on composition of the mixtures. Interface chemistry between fillers will be a key for establish materials designs for advanced copper-filled adhesives.

引用

页码：128 / 129

页数：2