Superlattice microrefrigerators flip-chip bonded with optoelectronic devices

被引:6
作者
Zhang, Y [1 ]
Zeng, GH [1 ]
Piprek, J [1 ]
Bar-Cohen, A [1 ]
Shakouri, A [1 ]
机构
[1] Univ Calif Santa Cruz, Dept Elect Engn, Santa Cruz, CA 95064 USA
来源
TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004 | 2004年
关键词
superlattice; microrefrigerators; integration; electrothennal; simulation; maximum cooling; cooling power density;
D O I
10.1109/STHERM.2004.1291323
中图分类号
O414.1 [热力学];
学科分类号
摘要
A 3D electrothermal model was developed to study the InP-based thin film In0.53Ga0.47As/In0.52Al0.48As superlattice microrefrigerators for various device sizes, ranging from 40x40mum(2) to 120x120mum(2). We discussed maximum cooling and cooling power densities for current devices, analyzed the non-idealities of current devices and proposed an optimized structure. The simulation results demonstrated a maximum cooling of 3degreesC with cooling power density over 300 W/cm(2) with an optimized structure based on the current device geometry. Furthermore, we also demonstrated that a maximum 2 cooling, over 10degreesC with power density over 900 W/cm(2), could be possible when the current figure of merit of InGaAs/InAlAs superlattice is enhanced five times with the non-conserved lateral momentum. Besides monolithic integration, we also propose a flip-chip bonded solution to integrate these microrefrigerator with the optoelectronic chips. Preliminary 3D electrothermal simulation will be present to analyze its cooling effects for this 2-chip integration model.
引用
收藏
页码:190 / 197
页数:8
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