Nanomechanical fracture-testing of thin films

被引：51
作者：
Kriese, MD
Boismier, DA
Moody, NR
Gerberich, WW [1 ]
机构：
[1] Univ Minnesota, Ctr Interfacial Engn, Minneapolis, MN 55455 USA
[2] Hutchinson Technol Inc, Hutchinson, MN USA
[3] Sandia Natl Labs, Livermore, CA USA
来源：
ENGINEERING FRACTURE MECHANICS | 1998年 / 61卷 / 01期
关键词：
interfacial fracture; indentation; scratch testing; nanomechanics; thin films;
D O I：
10.1016/S0013-7944(98)00050-2
中图分类号：
O3 [力学];
学科分类号：
08 ; 0801 ;
摘要：
Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics and characterized by the critical strain energy release rate. A 9.1 mu m thick phenol-formaldehyde polymer film on stainless steel was tested with indentation, scratching and edge-loading of fine lines. Also, sputtered copper and tungsten-copper bilayer films on SiO2, 150 to 1500 nm thick, were tested with indentation. (C) 1998 Elsevier Science Ltd. All rights reserved.
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页码：1 / 20
页数：20
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