Nanomechanical fracture-testing of thin films

被引：51

作者：

Kriese, MD

Boismier, DA

Moody, NR

Gerberich, WW ^{[1
]}

机构：

[1] Univ Minnesota, Ctr Interfacial Engn, Minneapolis, MN 55455 USA

[2] Hutchinson Technol Inc, Hutchinson, MN USA

[3] Sandia Natl Labs, Livermore, CA USA

来源：

ENGINEERING FRACTURE MECHANICS | 1998年 / 61卷 / 01期

关键词：

interfacial fracture; indentation; scratch testing; nanomechanics; thin films;

D O I：

10.1016/S0013-7944(98)00050-2

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics and characterized by the critical strain energy release rate. A 9.1 mu m thick phenol-formaldehyde polymer film on stainless steel was tested with indentation, scratching and edge-loading of fine lines. Also, sputtered copper and tungsten-copper bilayer films on SiO2, 150 to 1500 nm thick, were tested with indentation. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：1 / 20

页数：20

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