RF Performance Analysis of Graphene Nanoribbon Interconnect

被引：0

作者：

Das, Subhajit ^{[1
]}

Bhattacharya, Sandip ^{[1
]}

Das, Debaprasad ^{[2
]}

Rahaman, Hafizur ^{[1
]}

机构：

[1] Bengal Coll & Sci Univ, Sch VLSI Technol, Sibpur, India

[2] Assam Univ, Dept Elect & Telecommun, Silchar, India

来源：

2014 IEEE STUDENTS' TECHNOLOGY SYMPOSIUM (IEEE TECHSYM) | 2014年

关键词：

Graphene nanoribbon (GNR); interconnect; skin depth; Radio Frequency (RF); Very Large Scale Integration (VLSI); carbon nanotube (CNT);

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The work in this paper presents analysis of graphene nanoribbon (GNR) as nano-interconnect for radio-frequency (RF) VLSI circuits for 16 nm technology node. A frequency dependent electrical equivalent model is developed by calculating the circuit parameters based on interconnect geometry. Using the developed model the RF performance of GNR based interconnects is investigated and compared to that of copper based interconnects for 16 nm technology node. It is shown that GNR based interconnect shows better performance for operating in and beyond 1000 THz frequency range for shorter interconnect length.

引用

页码：105 / 110

页数：6

共 50 条

[31] Multi-layer graphene interconnect A feasibility study
Politou, Maria
Wu, Xiangyu
Contino, Antonino
Soree, Bart
Huyghebaert, Cedric
Lin, Dennis
Radu, Iuliana
Tokei, Zsolt
Asselberghs, Inge
2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC), 2016, : 200 - 202
[32] Modeling and performance analysis of MWCNT bundle interconnect based on state space method
Zhao, Songjie
Deng, Fang
MATERIALS RESEARCH EXPRESS, 2025, 12 (01)
[33] Carbon Nanofiber Interconnect RF Characteristics Improvement with Deposited Tungsten Contacts
Vyas, Anshul A.
Madriz, Francisco
Kanzaki, Nobuhiko
Wilhite, Patrick
Sun, Xuhui
Yamada, Toshishige
Yang, Cary Y.
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2014, 14 (03) : 2683 - 2686
[34] The High Performance Interconnect Architecture for Supercomputers
Simonov A.S.
Semenov A.S.
Shcherbak A.N.
Zhabin I.A.
Supercomputing Frontiers and Innovations, 2023, 10 (02) : 127 - 136
[35] Investigating the Applicability of Graphene Nanoribbon as Signal and Power Interconnects for Nanometer Designs
Das, Debaprasad
Rahaman, Hafizur
JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2016, 25 (02)
[36] Review of Graphene Nanoribbons A Rising Candidate in VLSI Interconnect Domain
Sharda, Vangmayee
Agarwal, R. P.
2014 RECENT ADVANCES IN ENGINEERING AND COMPUTATIONAL SCIENCES (RAECS), 2014,
[37] Reliability Study of Bilayer Graphene - Material for Future Transistor and Interconnect
Yu, Tianhua
Lee, Eun-Kyu
Briggs, Benjamin
Nagabhirava, Bhaskar
Yu, Bin
2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2010, : 80 - 83
[38] Analysis of thermal stress screen for performance improvement of RF system
Vipin Kumar
Life Cycle Reliability and Safety Engineering, 2021, 10 (1) : 15 - 18
[39] Performance Analysis of Squarely Packed Dimorphic MWCNT Bundle for High Speed VLSI Interconnect
Amin, Abu Bony
Ullah, Muhammad Sana
2020 IEEE CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING (CCECE), 2020,
[40] On-Chip Interconnect Analysis of Performance and Energy Metrics Under Different Design Goals
Zhang, Ling
Zhang, Yulei
Chen, Hongyu
Yao, Bo
Hamilton, Kevin
Cheng, Chung-Kuan
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2011, 19 (03) : 520 - 524

← 1 2 3 4 5 →