Ultra-thick gate oxides:: charge generation and its impact on reliability

被引:52
|
作者
Schwalke, U
Pölzl, M
Sekinger, T
Kerber, M
机构
[1] Infineon Technol AG, Reliabil Methodol, D-81739 Munich, Germany
[2] Infineon Technol MDCA, EZM, Villach, Austria
[3] Infineon Technol AG, AI QM WT, D-81541 Munich, Germany
关键词
D O I
10.1016/S0026-2714(01)00058-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, degradation and breakdown characteristics of ultra-thick gate oxides (T-ox: 50-150 nm) used in power MOS devices is investigated. Measurements indicate, that in addition to charge generation via Fowler-Nordheim tunneling, a second mechanism becomes dominant in ultra-thick gate oxides even at moderate electrical fields (i.e. 7-8 MV/cm). The results suggest, that impact ionization and related electron-hole pair creation by energetic electrons is responsible for the experimental observations. The impact of these results on the interpretation of lifetime extrapolations from accelerated tests will be discussed. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1007 / 1010
页数:4
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