Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)

被引：16

作者：

Nassim, K ^{[1
]}

Joannes, L

Cornet, A

Dilhaire, S

Schaub, E

Claeys, W

机构：

[1] Univ Catholique Louvain, Lab FYAM, B-1348 Louvain, Belgium

[2] Univ Bordeaux 1, Ctr Phys Mol Opt & Hertzienne, Lab Caracterisat Composants Elect, F-33405 Talence, France

[3] Univ Bordeaux 1, IXL, F-33405 Talence, France

来源：

MICROELECTRONICS AND RELIABILITY | 1998年 / 38卷 / 6-8期

关键词：

D O I：

10.1016/S0026-2714(98)00079-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：1341 / 1345

页数：5