Flux effect on void quantity and size in soldered joints

被引：59

作者：

Busek, D. ^{[1
]}

Dusek, K. ^{[1
]}

Ruzicka, D. ^{[1
]}

Placek, M. ^{[1
]}

Mach, P. ^{[1
]}

Urbanek, J. ^{[1
]}

Stary, J. ^{[2
]}

机构：

[1] Czech Tech Univ, Fac Elect Engn, Dept Electrotechnol, CR-16635 Prague, Czech Republic

[2] Brno Univ Technol, Dept Microelect, CS-61090 Brno, Czech Republic

来源：

MICROELECTRONICS RELIABILITY | 2016年 / 60卷

关键词：

Assembly manufacturing; Reliability; Soldering; Voids; Flux; RELIABILITY;

D O I：

10.1016/j.microrel.2016.03.009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：135 / 140

页数：6

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