Microstructure analysis of sputtered copper thin film in packaging substrate

被引:0
作者
Lyu, Ping [1 ]
Yu, Hongkun [1 ]
Wang, Techun [2 ]
机构
[1] Fudan Univ, Dept Mat Sci, Shanghai 200433, Peoples R China
[2] ASE Assembly & Test Shanghai Ltd, Shanghai 201203, Peoples R China
来源
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
关键词
packaging; sputtered copper film; microstructure;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The feature size of transistors is continuously decreasing while the wafer size is increasing, which presents new challenges to the interconnection between the chips and substrates. Currently, substrate has become the most influential factor of the cost in electronic packaging. In packaging substrate, the most commonly used conducting metal is copper, which is generally fabricated by electroplating process. Before electroplating, it typically requires a seed film of sputtered copper film formed as the electric conductor of the subsequent process. Because sputtered copper films are generally thinner than 1um, their polycrystalline microstructures are significantly different from that of the electro-plated copper on them. Therefore, it is worth further exploring whether the sputtered copper thin film of ultra-fine grains has expected microstructure and properties, and how it changes and affects the reliability of substrate in subsequent process. In this paper, Focused ion beam (FIB) was adopted to observe the microstructure of the sputtered thin copper film, then we used Image J (a public domain, Java-based image processing program) to measure and statistically analyze the grain size. Finally, we achieved a simple and reliable method to characterize and quantitatively analyze the microstructure of sputtered copper thin film.
引用
收藏
页码:656 / +
页数:2
相关论文
共 50 条
  • [41] Microstructure and Wear Resistance of Laser Cladded Coatings on Copper Substrate
    Wang Wenyan
    Lu Gao
    Dong Xiao-ming
    Xu Jing
    Xie Jing-pei
    ADVANCES IN MECHANICAL ENGINEERING, PTS 1-3, 2011, 52-54 : 1728 - 1731
  • [42] Redox of NiO thin film on YSZ (111) substrate
    Xing, Juanjuan
    Takeguchi, Masaki
    Tanaka, Miyoko
    Nakayama, Yoshiko
    SURFACE AND INTERFACE ANALYSIS, 2012, 44 (11-12) : 1483 - 1487
  • [43] Microstructure evolution of copper doped beryllium thin films
    Zhou Min-jie
    Luo Bing-chi
    Li Kai
    Zhang Ji-cheng
    Li Jia
    Wu Wei-dong
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2012, 22 (05) : 1151 - 1155
  • [44] CRITICAL ISSUES IN THIN-FILM MICROSTRUCTURE DEVELOPMENT
    SINGH, RK
    RAJAN, K
    JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (09) : 913 - 918
  • [45] Microstructure-Property relationships in thin film ITO
    Giusti, G.
    Tian, L.
    Jones, I. P.
    Abell, J. S.
    Bowen, J.
    THIN SOLID FILMS, 2009, 518 (04) : 1140 - 1144
  • [46] Magnetic properties and microstructure of thin-film media
    Chantrell, RW
    Tako, KM
    Wongsam, M
    Walmsley, N
    Schrefl, T
    JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 1997, 175 (1-2) : 137 - 147
  • [47] Microstructure and micromagnetics of future thin-film media
    Futamoto, M
    Inaba, N
    Hirayama, Y
    Ito, K
    Honda, Y
    JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 1999, 193 (1-3) : 36 - 43
  • [48] Microstructure and defect study in thin film heterostructure materials
    Wu F.
    Nanoscience and Nanotechnology - Asia, 2020, 10 (02): : 109 - 116
  • [49] Effect of dopant on microstructure and conductivity of ZnO thin film
    Liu, Y. H.
    Yan, Z.
    Zhou, X. Y.
    MATERIALS RESEARCH INNOVATIONS, 2013, 17 : S224 - S228
  • [50] Wear Scar Microstructure and Anti-Wear Mechanism of the Magnetron Sputtered Ag Film
    Cao Y.
    Xia Y.
    Duan B.
    Mu W.
    Mocaxue Xuebao/Tribology, 2022, 42 (02): : 225 - 233