Curing behaviour and thermal properties of epoxy resin cured by aromatic diamine with carborane

被引：23

作者：

Men, Xiuting ^{[1
]}

Cheng, Yan ^{[1
]}

Chen, Gong ^{[1
]}

Bao, Jianwen ^{[2
]}

Yang, Jiping ^{[1
]}

机构：

[1] Beihang Univ, Sch Mat Sci & Engn, Key Lab Aerosp Adv Mat & Performance, Minist Educ, Beijing 100191, Peoples R China

[2] Aviat Ind China, Composite Technol Ctr, Beijing, Peoples R China

来源：

HIGH PERFORMANCE POLYMERS | 2015年 / 27卷 / 04期

基金：

中国国家自然科学基金;

关键词：

Epoxy resin; carborane; curing agent; curing behaviour; thermal properties; HETEROCYCLIC RING; KINETICS; COMPOSITES; POLYMERS; NANOCOMPOSITES; DECOMPOSITION; DEGRADATION; STABILITY; NANOTUBES; CHEMISTRY;

D O I：

10.1177/0954008314557049

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

A new kind of carborane-containing aromatic diamine, 1,2-bis (4-aminophenyl)-1,2-dicarba-closo-dodecaborane (HPPA), as a curing agent for epoxy resins was synthesized and confirmed by proton, carbon and boron nuclear magnetic resonance imaging, Fourier transform infrared spectroscopy and elemental analysis. The compatibility, thermal curing behaviour and thermal properties of HPPA/epoxy resin E51 system were investigated. HPPA exhibited good compatibility with E51. Compared with 4,4-diaminodiphenylsulphone (DDS)/E51, HPPA/E51 system had higher reaction activity and lower curing temperature. When the ratio of amine protons versus epoxy groups was 1:1 in resin systems, the epoxy resin cured by HPPA exhibited the highest glass transition temperature of 207 degrees C. The residual weight ratios of cured HPPA/E51 at 800 degrees C under argon and in air atmospheres were 43.7% and 50.5%, respectively, which were 28.6% and 47.2% higher than that of DDS/E51, respectively, indicating that the HPPA/E51 system had good heat resistance.

引用

页码：497 / 509

页数：13

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