Influence of thickness of Hf buffer layer on the interfacial structures of sputtered HfO2 on SiO2/Si

被引:5
作者
Tan, RQ [1 ]
Azuma, Y [1 ]
Kojima, I [1 ]
机构
[1] AIST, Natl Metrol Inst Japan, Mat Characterizat, Tsukuba, Ibaraki 3058565, Japan
关键词
HfO2; sputtering deposition; XPS; annealing;
D O I
10.1016/j.apsusc.2004.10.061
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The influence of thickness of Hf-metal buffer layer on the interfacial diffusion and reaction was investigated using in situ Xray photoelectron spectroscopy, scanning Auger microscope and grazing incident X-ray reflectivity. Hf-metal firstly reacted with native Si oxide forming Hf silicates, and all Si-O was further reduced to be Si-0 after 1 nm Hf-metal deposition. The Hf-metal and Hf-suboxide in Hf(1 nm)/SiO2/Si structure were further oxidized to be Hf4+ during HfO2 sputtering deposition and post-deposition annealing. Si diffused out and reacted with HfO2 during annealing. The Hf(1 nm) buffer layer exhibited a better performance than the Hf(0.3 nm) buffer layer in suppressing the diffusion of Si and the reaction between diffused Si and HfO2. (c) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:21 / 25
页数:5
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