Microstructure and intermetallic formation in SnAgCuBGA components attached with SnPb solder under isothermal aging

被引：23

作者：

Choubey, Anupam ^{[1
,2
]}

Osterman, Michael ^{[1
]}

Pecht, Michael ^{[1
]}

机构：

[1] Univ Maryland, CALCE, Elect Prod & Syst Ctr, College Pk, MD 20742 USA

[2] Vicor Corp, Packaging Dev Team, Andover, MA 01810 USA

来源：

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2008年 / 8卷 / 01期

关键词：

backward compatibility; BGA components; ENIG; exemption; ImAg; ImSn; intermetallics; isothermal aging; microstructure; mixed solder joint; SnAgCu; SnPb; solder;

D O I：

10.1109/TDMR.2007.915049

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin-lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

引用

页码：160 / 167

页数：8

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