Microstructure and thermo-electrical transport properties of Cd-Sn alloys

被引:30
作者
Ari, M. [1 ]
Saatci, B. [1 ]
Gunduz, M. [1 ]
Meydaneri, F. [1 ]
Bozoklu, M. [1 ]
机构
[1] Erciyes Univ, Dept Phys, Fac Arts & Sci, Kayseri, Turkey
关键词
electrical resistivity; thermal conductivity; Cd-Sn alloys; SEM; four-point probe method;
D O I
10.1016/j.matchar.2007.05.014
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The thermophysical transport properties of Cd-Sn alloys have been investigated for six samples. The electrical resistivity measurements were obtained by using a standard dc four-point probe technique in the temperature range of 300 K-550 K. The resistivity of samples increases linearly with temperature and the electrical current mainly flows through the Sn phase channel. The electrical conductivity of samples is inversely proportional to temperature. Also, thermal conductivity of the Cd-Sn alloys was determined. The phonon component contribution of thermal conductivity dominates the thermal conduction processes at T<500 K. The electronic component contribution of thermal conductivity affects the thermal transport process at T>500 K. The thermal conductivity of the Cd-Sn alloys also depends on the grain size and grain boundary of the pure Cd and the pure Sri phases in the matrix. The temperature coefficient of resistivity was also determined, which is independent with the alloying elements. (C) 2007 Elsevier Inc. All rights reserved.
引用
收藏
页码:624 / 630
页数:7
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