High temperature electrical resistivity and Seebeck coefficient of Ge2Sb2Te5 thin films

被引:36
作者
Adnane, L. [1 ]
Dirisaglik, F. [2 ]
Cywar, A. [1 ]
Cil, K. [1 ]
Zhu, Y. [3 ]
Lam, C. [3 ]
Anwar, A. F. M. [1 ]
Gokirmak, A. [1 ]
Silva, H. [1 ]
机构
[1] Univ Connecticut, Dept Elect & Comp Engn, Storrs, CT 06269 USA
[2] Eskisehir Osmangazi Univ, Dept Elect & Elect Engn, TR-26480 Eskisehir, Turkey
[3] IBM Watson Res Ctr, Yorktown Hts, NY 10598 USA
基金
美国国家科学基金会;
关键词
PHASE-CHANGE MEMORY; RECORDING MEDIA; GESBTE FILMS; TRANSITION; CONDUCTIVITY; SCHERRER; DENSITY; STATES; CELLS; SIZE;
D O I
10.1063/1.4996218
中图分类号
O59 [应用物理学];
学科分类号
摘要
High-temperature characterization of the thermoelectric properties of chalcogenide Ge2Sb2Te5 (GST) is critical for phase change memory devices, which utilize self-heating to quickly switch between amorphous and crystalline states and experience significant thermoelectric effects. In this work, the electrical resistivity and Seebeck coefficient are measured simultaneously as a function of temperature, from room temperature to 600 degrees C, on 50 nm and 200 nm GST thin films deposited on silicon dioxide. Multiple heating and cooling cycles with increasingly maximum temperature allow temperature-dependent characterization of the material at each crystalline state; this is in contrast to continuous measurements which return the combined effects of the temperature dependence and changes in the material. The results show p-type conduction (S > 0), linear S(T), and a positive Thomson coefficient (dS/dT) up to melting temperature. The results also reveal an interesting linearity between dS/dT and the conduction activation energy for mixed amorphous-fcc GST, which can be used to estimate one parameter from the other. A percolation model, together with effective medium theory, is adopted to correlate the conductivity of the material with average grain sizes obtained from XRD measurements. XRD diffraction measurements show plane-dependent thermal expansion for the cubic and hexagonal phases. Published by AIP Publishing.
引用
收藏
页数:9
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