共 24 条
- [1] ABDULLETTIF AM, 1997, THESIS U BAGHDAD
- [3] Berry R. W., 1968, THIN FILM TECHNOLOGY
- [4] SCANNING AUGER MICRO-PROBE STUDY OF GOLD-NICKEL-COPPER DIFFUSION IN THIN-FILMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (02): : 339 - 342
- [6] POROSITY IN THIN NI/AU METALLIZATION LAYERS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (03): : 337 - 342
- [8] DIFFUSION PROBLEMS IN MICRO-ELECTRONIC PACKAGING [J]. THIN SOLID FILMS, 1978, 53 (02) : 175 - 182
- [10] MECHANISMS OF INTERDIFFUSION IN COPPER NICKEL THIN-FILM COUPLES [J]. JOURNAL OF APPLIED PHYSICS, 1986, 59 (04) : 1147 - 1155