Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

被引:87
作者
Oshman, Christopher [1 ]
Li, Qian [1 ]
Liew, Li-Anne [1 ]
Yang, Ronggui [1 ]
Lee, Y. C. [1 ]
Bright, Victor M. [1 ]
Sharar, Darin J. [2 ]
Jankowski, Nicholas R. [3 ]
Morgan, Brian C. [3 ]
机构
[1] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
[2] Gen Tech Serv LLC, Wall, NJ USA
[3] USA, Res Lab, Adelphi, MD USA
基金
美国国家科学基金会;
关键词
Flexible electronics - Heat resistance - Spreaders - Thermal conductivity - Heat transfer - Filled polymers - Finite element method - Heating equipment - Acceleration - Heat pipes - Liquid crystal polymers;
D O I
10.1088/0960-1317/22/4/045018
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the fabrication and application of a micro-scale hybrid wicking structure in a flat polymer-based heat pipe heat spreader, which improves the heat transfer performance under high adverse acceleration. The hybrid wicking structure which enhances evaporation and condensation heat transfer under adverse acceleration consists of 100 mu m high, 200 mu m wide square electroplated copper micro-pillars with 31 mu m wide grooves for liquid flow and a woven copper mesh with 51 mu m diameter wires and 76 mu m spacing. The interior vapor chamber of the heat pipe heat spreader was 30x30x1.0 mm(3). The casing of the heat spreader is a 100 mu m thick liquid crystal polymer which contains a two-dimensional array of copper-filled vias to reduce the overall thermal resistance. The device performance was assessed under 0-10 g acceleration with 20, 30 and 40 W power input on an evaporator area of 8x8 mm(2). The effective thermal conductivity of the device was determined to range from 1653 W (m K)(-1) at 0 g to 541 W (m K)(-1) at 10 g using finite element analysis in conjunction with a copper reference sample. In all cases, the effective thermal conductivity remained higher than that of the copper reference sample. This work illustrates the possibility of fabricating flexible, polymer-based heat pipe heat spreaders compatible with standardized printed circuit board technologies that are capable of efficiently extracting heat at relatively high dynamic acceleration levels.
引用
收藏
页数:12
相关论文
共 19 条
[1]  
[Anonymous], 1965, Electronics
[2]  
[Anonymous], 1994, INTRO HEAT PIPES
[3]  
Chamarthy P, 2009, P ASME 2009 INTERPAC, P1
[4]   High performance flat miniature heat pipes fabricated by UD-LIGA process [J].
Cheng, Y ;
Ding, PP ;
Sheu, TS ;
Shew, BY ;
Chen, PH .
MICROSYSTEM TECHNOLOGIES, 2002, 9 (1-2) :23-24
[5]  
de Bock HP, 2011, P ASME JSME 8 THERM
[6]  
Ding C, 2010, P NSTI NAN 2010, V1, P616
[7]  
Fahgri A., 1995, HEAT PIPE SCI TECHNO
[8]   Development of phase change heat spreader for treatment of intractable neocortical epilepsy [J].
Hilderbrand, J. K. ;
Peterson, G. P. ;
Rothman, S. M. .
HEAT TRANSFER ENGINEERING, 2007, 28 (04) :282-291
[9]   Micro heat pipes in low temperature cofire ceramic (LTCC) substrates [J].
Jones, WK ;
Liu, YQ ;
Gao, MC .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (01) :110-115
[10]   Air cooling of a microelectronic chip with diverging metal microchannels monolithically processed using a single mask [J].
Joo, Youngcheol ;
Yeh, Hsin-Chih Tim ;
Dieu, Kiet ;
Kim, Chang-Jin .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (11)