Reliability-Aware Design Space Exploration for Fully Integrated RF CMOS PA

被引:6
作者
Pazos, Sebastian [1 ]
Aguirre, Fernando [1 ]
Palumbo, Felix [1 ]
Silveira, Fernando [2 ]
机构
[1] UTN BA, CONICET, UIDI, C1179AAQ, Buenos Aires, DF, Argentina
[2] Univ Republica, IIE FI, Montevideo 11300, Uruguay
关键词
Stress; Human computer interaction; Radio frequency; Degradation; Reliability engineering; Mathematical model; CMOS; RF; power amplifier; design for reliabilty; TDDB; HCI; HOT-CARRIER; CIRCUIT RELIABILITY; MOSFET DEGRADATION; BREAKDOWN; STRESS; BIAS; DC; MECHANISMS;
D O I
10.1109/TDMR.2019.2957489
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A design for reliability approach is proposed for fully integrated RF CMOS class A-to-C power amplifiers. Reliability hazards like time dependent dielectric breakdown and hot carrier injection are mapped into the design space, including the expected parametric degradation of the circuit, by fitting widely accepted models to experimental degradation results on the target technology. A prototype amplifier was used to validate RF degradation models and their impact on the output power degradation under accelerated stress. The methodology is based on a design space exploration of the highest efficiency designs attainable in a target technology. Electrical characteristics of passives and transistors are considered through look-up tables. The proposed approach allows to reduce the full universe of available designs to those that are specification and reliability compliant, avoiding a simulator-in-the-loop approach. A test case for a 3 dBm output power amplifier from the design space shows good agreement between predictions and SPICE simulations, including projected parametric degradation due to hot carrier injection.
引用
收藏
页码:33 / 41
页数:9
相关论文
共 47 条
[31]  
Raheja D., 2012, Design for Reliability, P1, DOI DOI 10.1002/9781118310052
[32]   Microscopic scale characterization and modeling of transistor degradation under HC stress [J].
Randriamihaja, Yoann Mamy ;
Huard, V. ;
Federspiel, X. ;
Zaka, A. ;
Palestri, P. ;
Rideau, D. ;
Roy, D. ;
Bravaix, A. .
MICROELECTRONICS RELIABILITY, 2012, 52 (11) :2513-2520
[33]   A reliability-aware RF power amplifier design for CMOS radio chip integration [J].
Ruberto, Mark ;
Degani, Ofir ;
Wail, Shay ;
Tendler, Alex ;
Fridman, Amir ;
Goltman, Germady .
2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL, 2008, :536-540
[34]   Climate change, 2007 [J].
Saier, M. H., Jr. .
WATER AIR AND SOIL POLLUTION, 2007, 181 (1-4) :1-2
[35]   MOSFET Degradation Under RF Stress [J].
Sasse, Guido T. ;
Kuper, Fred G. ;
Schmitz, Jurriaan .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (11) :3167-3174
[36]   The Relation Between Degradation Under DC and RF Stress Conditions [J].
Scholten, Andries J. ;
Stephens, Daniel ;
Smit, Geert D. J. ;
Sasse, Guido T. ;
Bisschop, Jaap .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (08) :2721-2728
[37]   Negative bias temperature instability: What do we understand? [J].
Schroder, Dieter K. .
MICROELECTRONICS RELIABILITY, 2007, 47 (06) :841-852
[38]   Reliability projection for ultra-thin oxides at low voltage [J].
Stathis, JH ;
DiMaria, DJ .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :167-170
[39]   Reliability limits for the gate insulator in CMOS technology [J].
Stathis, JH .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2002, 46 (2-3) :265-286
[40]  
Taur Y., 2009, Fundamentals of Modern VLSI Devices, V2nd