GaN power switches on the rise: Demonstrated benefits and unrealized potentials

被引:54
作者
Chu, Rongming [1 ]
机构
[1] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
关键词
FIELD-EFFECT TRANSISTORS; STRESS-CONTROL; DEVICES; SI(111);
D O I
10.1063/1.5133718
中图分类号
O59 [应用物理学];
学科分类号
摘要
As a wide bandgap semiconductor with high breakdown field, GaN is expected to outperform the incumbent Si technology for power switching applications. Advances in GaN epitaxial growth, device technology, and circuit implementations have resulted in high-performing power switches based on the GaN high electron mobility transistor (HEMT) structure. Demonstrated system benefits have validated the real value of GaN power switching technology. However, the full potential of GaN power switching technology is still far from being exploited. Various factors, including the size of electrodes and wiring, non-optimal E-field shaping, and substrate capacitive coupling, are limiting the performance of GaN HEMT power switches. Emerging device structures, such as, vertical transistors and multichannel superjunction transistors, have the potential to overcome some of those limitations, thereby bringing the performance benefits of the GaN power switching technology to a new level. Understanding the underlying physics is important to the success of the emerging device structures. Published under license by AIP Publishing.
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页数:5
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