Copper-Containing Catalyst with Fixed Active Component on an Alumina-Silica Carrier

It was found that the low thermal stability of commercial copper-containing catalyst (BASF Company) is associated with the chemical non-fixing of the active component on the surface of the silica carrier, while the degradation of its strength is due to the phase transition of the SiO2 carrier (alpha-quartz) into alpha-cristobalite. A thermally stable copper-containing catalyst MAK-K with an active component firmly bound with an alumina-silica carrier is proposed and studied. Experimental tests of the catalysts for thermal stability show that at 350A degrees C the relative activity of the catalyst N3-11 decreases by 41%, while the relative activity of the catalyst MAK-K changes by only 15%.