Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: Simulation and experiment

被引：23

作者：

Lin, YM ^{[1
]}

Eichele, C

Shi, FG

机构：

[1] Univ Calif Irvine, Optoelect Integrat & Packaging Lab, Irvine, CA 92697 USA

[2] ITT Cannon, Fiber Opt Div, Santa Ana, CA 92705 USA

来源：

JOURNAL OF LIGHTWAVE TECHNOLOGY | 2005年 / 23卷 / 02期

关键词：

butterfly laser diode package; fiber optic component attachment; finite-element method (FEM); laser welding; packaging yield; welding-induced-alignment-distortion (WIAD); welding sequence;

D O I：

10.1109/JLT.2004.841780

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Controlling welding-induced-alignment-distortion (WIAD) and maintaining coupling efficiency is obviously the most challenging issue in assembling of fiber-optic components using laser welding. WIAD is the dominant barrier to having high packaging yields. Previous investigation has revealed that the WIAD in butterfly laser diode module packaging could be mitigated by properly choosing weld process parameters such as welding sequence. In this paper, the effect of welding sequence on WIAD is studied numerically by finite-element method (FEM) with a more realistic physics based laser welding model and experimentally by welding prototype butterfly packages. Results from both methods are compared. It is shown that the influence of welding process parameters on WIAD is significant and WIAD control is possible if proper welding sequence is employed.

引用

页码：615 / 623

页数：9

共 18 条

[1] A study on the prediction of the laser weld shape with varying heat source equations and the thermal distortion of a small structure in micro-joining [J].

Chang, WS ;

Na, SJ .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2002, 120 (1-3) :208-214

[2]

Frewin MR, 1999, WELD J, V78, p15S

[3]

HEYLER R, 1999, FIBEROPTIC PRODU AUG

[4] Post-weld-shift in bufferfly package [J].

Huang, WK ;

Hsu, YC ;

Sheen, MT ;

Cheng, WH .

PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, :77-82

[5] Automation manufacturing systems technology for opto-electronic device packaging [J].

Jang, S .

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, :10-14

[6]

KOWALSKI VT, 1995, ELEC COMP C, P1116, DOI 10.1109/ECTC.1995.517832

[7]

Kuang JH, 2001, IEEE TRANS ADV PACK, V24, P81, DOI 10.1109/6040.909629

[8] Finite element analysis of post-weld shift during fiber pigtail of 980 nm pump lasers [J].

Labudovic, M ;

Burka, M .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (01) :41-46

[9] Effect of welding sequence on laser welding induced alignment distortion in butterfly laser diode module packages [J].

Lin, YM ;

Shi, FG .

PHOTONICS PACKAGING AND INTEGRATION III, 2003, 4997 :30-39

[10] Laser welding induced alignment distortion in butterfly laser module packages: Effect of welding sequence [J].

Lin, YM ;

Liu, WM ;

Shi, FG .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (01) :73-78

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