Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation

被引:45
作者
Dai, Houfu [1 ,2 ]
Hu, Yang [1 ]
Wu, Weilong [1 ]
Yue, Haixia [1 ]
Meng, Xiaosong [1 ]
Li, Ping [2 ]
Duan, Huigao [2 ]
机构
[1] Guizhou Univ, Coll Mech Engn, Guiyang 550025, Peoples R China
[2] Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Ion implantation; Surface modification; Ultra-precision machining; Molecular dynamics; SURFACE-ROUGHNESS; CHIP THICKNESS; SILICON; BRITTLE; DEFORMATION; NANOINDENTATION; AMORPHIZATION; MACHINABILITY; TECHNOLOGY; MECHANISMS;
D O I
10.1016/j.jmapro.2021.07.055
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, molecular dynamics simulations were performed to simulate ion implantation and diamond grinding processes of SiC. Moreover, workpiece surface roughness was predicted based on Rayleigh probability distribution. Effects of ion implantation energy on the temperature, potential energy, cutting force, friction coefficient, and surface morphology of the workpiece during machining were analyzed. It has been revealed that the higher the ion implantation energy, the higher the proportion of internal damage, the lower the temperature rise rate in the workpiece, the lower the cutting force, the smaller the length and number of dislocations, the higher the removal efficiency of single abrasive particles, and the higher the final surface roughness. Among them, the changing trend of surface roughness is qualitative analysis under specific experimental conditions. In conclusion, ion implantation is favorable to SiC processing, and revealing its influence mechanisms has important guiding significance for practical applications.
引用
收藏
页码:398 / 411
页数:14
相关论文
共 52 条
[1]  
[Anonymous], 2013, PROD ENG, V7, P251
[2]   A predictive model of the critical undeformed chip thickness for ductile-brittle transition in nano-machining of brittle materials [J].
Arif, Muhammad ;
Zhang Xinquan ;
Rahman, Mustafizur ;
Kumar, Senthil .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2013, 64 :114-122
[3]  
Bhalla A., 2021, ATZelectronics Worldw, V16, P18
[4]   Ductile-regime grinding. A new technology for machining brittle materials [J].
Bifano, T.G. ;
Dow, T.A. ;
Scattergood, R.O. .
Journal of engineering for industry, 1991, 113 (02) :184-189
[5]   Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation [J].
Cai, M. B. ;
Li, X. P. ;
Rahman, A. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2007, 192 (607-612) :607-612
[6]   Molecular dynamics simulations of mechanical deformation of amorphous silicon dioxide during chemical-mechanical polishing [J].
Chagarov, E ;
Adams, JB .
JOURNAL OF APPLIED PHYSICS, 2003, 94 (06) :3853-3861
[7]   Molecular dynamics simulation study of deformation mechanisms in 3C-SiC during nanometric cutting at elevated temperatures [J].
Chavoshi, Saeed Zare ;
Luo, Xichun .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 654 :400-417
[8]   Mechanical model of single abrasive during chemical mechanical polishing: Molecular dynamics simulation [J].
Chen, Ruling ;
Li, Shaoxian ;
Wang, Zhe ;
Lu, Xinchun .
TRIBOLOGY INTERNATIONAL, 2019, 133 :40-46
[9]  
Chen Y, 2014, J TIANJIN U, V020, P203
[10]   Surface modification for brittle monocrystalline materials by MeV ions [J].
Chen, Y. H. ;
Fang, F. Z. ;
Xu, Z. W. ;
Zhang, X. D. ;
Hu, X. T. .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2012, 272 :433-436