New challenges and opportunities for 3D Integrations

被引：0

作者：

Michailos, J. ^{[1
]}

Coudrain, P. ^{[1
]}

Farcy, A. ^{[1
]}

Hotellier, N. ^{[1
]}

Cheramy, S. ^{[2
]}

Lhostis, S. ^{[1
]}

Deloffre, E. ^{[1
]}

Sanchez, Y. ^{[1
]}

Jouve, A. ^{[2
]}

Guyader, F. ^{[1
]}

Saugier, E. ^{[1
]}

Fiori, V. ^{[1
]}

Vivet, P. ^{[2
]}

Vinet, M. ^{[2
]}

Fenouillet-Beranger, C. ^{[2
]}

Casset, F. ^{[2
]}

Batude, P. ^{[2
]}

Boeuf, F. ^{[1
]}

Henrion, Y. ^{[1
]}

Vianne, B. ^{[1
]}

Collin, L. -M. ^{[1
]}

Colonna, J. -P. ^{[2
]}

Benaissa, L. ^{[2
]}

Brunet, L. ^{[2
]}

Prieto, R. ^{[1
]}

Velard, R. ^{[1
]}

Ponthenier, F. ^{[2
]}

机构：

[1] STMicroelectronics, F-38926 Crolles, France

[2] Univ Grenoble Alpes, CEA, F-38054 Grenoble, France

来源：

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2015年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCube (TM) solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.

引用

页数：4

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