Humidity-dependent mechanical properties of polyimide films and their use for IC-compatible humidity sensors

被引:54
作者
Sager, K
Schroth, A
Nakladal, A
Gerlach, G
机构
[1] Institute of Solid-State Electronics, Dresden University of Technology, D-01062 Dresden
关键词
polyimide; humidity; swelling; polyimide curing; simulation;
D O I
10.1016/0924-4247(96)01132-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thin polyimide layers have been investigated to determine their volume expansion as a result of humidity absorption and desorption, respectively. Furthermore, we have used the experiments in order to clarify the physical and chemical processes of polyimide films in a wet environment as well as their humido-mechanical properties. It can be shown that the humidity-induced material extension is fairly linear in a wide range of humidity. The observed material behaviour strongly depends on the conditions of the polyimide fabrication process. Analogous to the well-known temperature extension coefficient, a humidity extension value of about 60 to 80 ppm/%RH is observed. This physical effect can be used to create piezoresistive humidity sensors working similarly to bimetal elements influenced by temperature.
引用
收藏
页码:330 / 334
页数:5
相关论文
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