Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist

被引：137

作者：

Lorenz, H ^{[1
]}

Despont, M

Vettiger, P

Renaud, P

机构：

[1] Swiss Fed Inst Technol, DMT IMS, CH-1015 Lausanne, Switzerland

[2] IBM Corp, Div Res, Zurich Res Lab, CH-8803 Ruschlikon, Switzerland

来源：

MICROSYSTEM TECHNOLOGIES | 1998年 / 4卷 / 03期

关键词：

Nickel; Rapid Prototype; Innovative Method; High Thickness; Small Gear;

D O I：

10.1007/s005420050118

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An innovative method for fabrication and rapid prototyping of high-aspect ratio micromechanical components in photoresist is discussed. The photoresist is an epoxy-negative-tone resist, called SU-8, which can be structured to more than 2 mm in thickness by UV exposure. Small gears of 530 mu m in diameter and 200 mu m in thickness have been realized in this photoplastic and their functionality has been demonstrated. In addition a process called MIMOTEC(TM) (MIcroMOlds TEChnology) has been established for the fabrication of metallic micromolds. MIMOTEC(TM) is based on the use of the SU-8 spun on high thicknesses and electrodeposition of nickel. Thermoplastic microcomponents have been injected and mounted in watches.

引用

页码：143 / 146

页数：4

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