The structure of the underpotential deposition of copper on to Pt(111) in the presence of chloride anions: a LEED structure analysis

被引：17

作者：

Bludau, H ^{[1
]}

Wu, K ^{[1
]}

Zei, MS ^{[1
]}

Eiswirth, M ^{[1
]}

Over, H ^{[1
]}

Ertl, G ^{[1
]}

机构：

[1] Max Planck Gesell, Fritz Haber Inst, D-14195 Berlin, Germany

来源：

SURFACE SCIENCE | 1998年 / 402卷 / 1-3期

关键词：

Cu deposition; electrochemistry; LEED; Pt(111);

D O I：

10.1016/S0039-6028(97)01061-3

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The underpotential deposition (UPD) of copper on to Pt(111) in the presence of chloride anions was studied by full-dynamical LEED-intensity analyses. A deformed (4 x 4) LEED pattern was observed at an emersion potential of 0.36 V vs. Ag/AgCl, right in between the two characteristic and well-separated peaks of the cyclic voltammogram (CV). Corresponding LEED intensity measurements and simulations of the integral-order beams indicate that the UPD of Cu forms a single pseudomorphic Cu layer on Pt(111). (C) 1998 Elsevier Science B.V. All rights reserved.

引用

页码：786 / 789

页数：4

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