Micro-tension study of miniaturized Cu lines at variable temperatures

被引：12

作者：

Wimmer, A. ^{[1
]}

Heinz, W. ^{[1
]}

Leitner, A. ^{[2
]}

Detzel, T. ^{[3
]}

Robl, W. ^{[4
]}

Kirchlechner, C. ^{[2
,5
]}

Dehm, G. ^{[5
]}

机构：

[1] Kompetenzzentrum Automobil & Ind Elekt GmbH, A-9524 Villach, Austria

[2] Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria

[3] Infineon Technol Austria AG, A-9500 Villach, Austria

[4] Infineon Technol Germany AG, D-93049 Regensburg, Germany

[5] Max Planck Inst Eisenforsch GmbH, D-40237 Dusseldorf, Germany

来源：

ACTA MATERIALIA | 2015年 / 92卷

关键词：

Micromechanics; In situ; EBSD; GND density; Deformation mechanisms; STRAIN-RATE SENSITIVITY; POLYCRYSTALLINE COPPER WIRES; APPARENT ACTIVATION VOLUME; THIN COPPER; GRAIN-SIZE; FCC METALS; MECHANICAL-PROPERTIES; GRADIENT PLASTICITY; THERMAL ACTIVATION; FATIGUE BEHAVIOR;

D O I：

10.1016/j.actamat.2015.03.056

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, tension experiments on Cu micro-samples at temperatures between 143 and 873 K were performed in order to analyze the influence of grain size, temperature and strain rate on the mechanical properties and fracture mode. The activation energy and evolution of the dislocation density have been analyzed to identify the deformation mechanisms. A transition from bulk-like to stochastic, small-scale behavior has been found with increasing grain size. Furthermore, dependent on the grain size and temperature a change from dislocation based plasticity to diffusion controlled deformation was observed. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：243 / 254

页数：12

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