Theoretical analysis of faceted void dynamics in metallic thin films under electromigration conditions

被引：3

作者：

Ho, HS ^{[1
]}

Gungor, MR ^{[1
]}

Maroudas, D ^{[1
]}

机构：

[1] Univ Calif Santa Barbara, Dept Chem Engn, Santa Barbara, CA 93106 USA

来源：

COMPUTATIONAL AND MATHEMATICAL MODELS OF MICROSTRUCTURAL EVOLUTION | 1998年 / 529卷

关键词：

D O I：

10.1557/PROC-529-21

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A theoretical analysis is presented of the electromigration-induced dynamics of transgranular voids in metallic thin films. The analysis is based on self-consistent dynamical simulations of current-driven void surface propagation coupled with the distribution of the electric field in the metallic film. The simulation predictions highlight the rich nonlinear dynamics of current-driven evolution of voids that become faceted due to the strongly anisotropic nature of surface diffusion. The numerical results are analyzed based on approximate analytical solutions to faceted void migration and a linearized theory for the morphological stability of planar void facets.

引用

页码：21 / 26

页数：6