Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

被引：23

作者：

He, Hongwen ^{[1
]}

Zhao, Haiyan ^{[1
]}

Guo, Fu ^{[2
]}

Xu, Guangchen ^{[2
]}

机构：

[1] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China

[2] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY | 2012年 / 28卷 / 01期

基金：

北京市自然科学基金; 中国博士后科学基金;

关键词：

Bi layer formation; Current density; Electromigration; Joule heating; ELECTROMIGRATION; MICROSTRUCTURE;

D O I：

10.1016/S1005-0302(12)60022-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Bi layer formation in Cu/Sn-58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which indicated that Bi was the main diffusing species migrating from the cathode to the anode. The electromigration force and Joule heating took on the main driving forces for Bi diffusion and migration. In addition, two appearance types of Bi layers, planar-type and groove-type, were found during current stressing. The morphology and thickness of Bi layers were affected by current density and current stressing time.

引用

页码：46 / 52

页数：7

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