Variability in nanoscale CMOS technology

被引:13
作者
Kuhn, Kelin [1 ]
机构
[1] Intel Corp, Portland Technol Dev, Hillsboro, OR 97124 USA
关键词
CMOS; variation; SRAM; V-ccmin; THRESHOLD VOLTAGE FLUCTUATION; DECANANOMETER MOSFETS; LEAKAGE;
D O I
10.1007/s11432-011-4219-6
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Moore's Law technology scaling has improved VLSI performance by five orders of magnitude in the last four decades. As advanced technologies continue the pursuit of Moore's Law, a variety of challenges will need to be overcome. One of these challenges is management of process variation. This paper discusses the importance of process variation in modern CMOS transistor technology, reviews front-end variation sources, presents device and circuit variation measurement techniques (including circuit and SRAM data from the 32 nm node), and compares recent intrinsic transistor variation performance from the literature.
引用
收藏
页码:936 / 945
页数:10
相关论文
共 30 条
[1]  
Ahsan I., 2006, VLSI TECHNOLOGY DIGE, P170, DOI DOI 10.1109/VLSIT.2006.1705271
[2]   Low Leakage and Low Variability Ultra-Thin Body and Buried Oxide (UT2B) SOI Technology for 20nm Low Power CMOS and Beyond [J].
Andrieu, F. ;
Weber, O. ;
Mazurier, J. ;
Thomas, O. ;
Noel, J-P. ;
Fenouillet-Beranger, C. ;
Mazellier, J-P ;
Perreau, P. ;
Poiroux, T. ;
Morand, Y. ;
Morel, T. ;
Allegret, S. ;
Loup, V. ;
Barnola, S. ;
Martin, F. ;
Damlencourt, J-F ;
Servin, I. ;
Casse, M. ;
Garros, X. ;
Rozeau, O. ;
Jaud, M-A. ;
Cibrario, G. ;
Cluzel, J. ;
Toffoli, A. ;
Allain, F. ;
Kies, R. ;
Lafond, D. ;
Delaye, V. ;
Tabone, C. ;
Tosti, L. ;
Brevard, L. ;
Gaud, P. ;
Paruchuri, V. ;
Bourdelle, K. K. ;
Schwarzenbach, W. ;
Bonnin, O. ;
Nguyen, B-Y ;
Doris, B. ;
Boeuf, F. ;
Skotnicki, T. ;
Faynot, O. .
2010 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2010, :57-+
[3]  
Arnaud F, 2009, INT EL DEVICES MEET, P603
[4]   Random dopant induced threshold voltage lowering and fluctuations in sub-0.1 μm MOSFET's:: A 3-D "atomistic" simulation study [J].
Asenov, A .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (12) :2505-2513
[5]   Intrinsic parameter fluctuations in decananometer MOSFETs introduced by gate line edge roughness [J].
Asenov, A ;
Kaya, S ;
Brown, AR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (05) :1254-1260
[6]   Poly-Si-gate-related variability in decananometer MOSFETs with conventional architecture [J].
Brown, Andrew R. ;
Roy, Gareth ;
Asenov, Asen .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (11) :3056-3063
[7]  
Capodieci L, 1996, P SPIE, V6154
[8]   Estimation of fixed charge densities in hafnium-silicate gate dielectrics [J].
Kaushik, Vidya S. ;
O'Sullivan, Barry J. ;
Pourtois, Geoffrey ;
Van Hoornick, Nausikaa ;
Delabie, Annelies ;
Van Elshocht, Sven ;
Deweerd, Wim ;
Schram, Tom ;
Pantisano, Luigi ;
Rohr, Erika ;
Ragnarsson, Lars-Ake ;
De Gendt, Stefan ;
Heyns, Marc .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (10) :2627-2633
[9]   Limit of gate oxide thickness scaling in MOSFETs due to apparent threshold voltage fluctuation induced by tunnel leakage current [J].
Koh, M ;
Mizubayashi, W ;
Iwamoto, K ;
Murakami, H ;
Ono, T ;
Tsuno, M ;
Mihara, T ;
Shibahara, K ;
Miyazaki, S ;
Hirose, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (02) :259-264
[10]  
Kuhn Kelin, 2008, Intel Technology Journal, V12, P93