Multi-parameters optimization for microchannel heat sink using inverse problem method

被引:113
作者
Wang, Zheng-Hua [1 ]
Wang, Xiao-Dong [1 ]
Yan, Wei-Mon [2 ]
Duan, Yuan-Yuan [3 ]
Lee, Duu-Jong [4 ]
Xu, Jin-Liang [1 ]
机构
[1] N China Elect Power Univ, Beijing Key Lab New & Renewable Energy, Beijing 102206, Peoples R China
[2] Natl Univ Tainan, Dept Greenergy, Tainan 70005, Taiwan
[3] Tsinghua Univ, Key Lab Thermal Sci & Power Engn MOE, Beijing 100084, Peoples R China
[4] Natl Taiwan Univ Sci & Technol, Coll Engn, Dept Chem Engn, Taipei 106, Taiwan
基金
中国国家自然科学基金;
关键词
Micro-channel; Heat sink; Optimization; Inverse geometry design; LAMINAR LIQUID FLOW; RECTANGULAR MICROCHANNELS; NUMERICAL OPTIMIZATION; THERMAL PERFORMANCE; FLUID-FLOW; DESIGN; CONDUCTION; CHANNELS;
D O I
10.1016/j.ijheatmasstransfer.2011.01.029
中图分类号
O414.1 [热力学];
学科分类号
摘要
This work describes an inverse problem method to optimize the geometric design for microchannel heat sinks using a novel multi-parameter optimization approach, which integrates the simplified conjugate-gradient scheme and a fully developing three-dimensional heat transfer and flow model. Overall thermal resistance is the objective function to be minimized with number of channels, N, channel aspect ratio, alpha, and the ratio of channel width to pitch, beta, as search variables. With a constant bottom area (10 mm x 10 mm), constant heat flux applied to the heat sink bottom surface (100 W cm(-2)), and constant pumping power (0.05 W), the optimal design values are N = 71, alpha = 8.24, and beta = 0.6, with a minimum overall thermal resistance of 0.144 K W(-1). Increasing pumping power reduces overall thermal resistance of the optimal design; however, the design's effectiveness declines significantly under high pumping power. The N and alpha values in the optimal design increase and beta decreases as pumping power increases. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2811 / 2819
页数:9
相关论文
共 31 条
[1]  
AIBAKHIT H, 2006, APPL THERM ENG, V26, P596
[2]  
Ambatipudi KK, 2000, NUMER HEAT TR A-APPL, V37, P711
[3]  
[Anonymous], APPL HEAT TRANSFER E
[4]   Constructal cooling channels for micro-channel heat sinks [J].
Bello-Ochende, T. ;
Liebenberg, L. ;
Meyer, J. P. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2007, 50 (21-22) :4141-4150
[5]   Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance [J].
Chein, Reiyu ;
Chen, Janghwa .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2009, 48 (08) :1627-1638
[6]   Optimum thermal design of microchannel heat sinks by the simulated annealing method [J].
Chen, Chih-Wei ;
Lee, Ji-Jen ;
Kou, Hong-Sen .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2008, 35 (08) :980-984
[7]   Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging [J].
Fedorov, AG ;
Viskanta, R .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2000, 43 (03) :399-415
[8]   Conduction and entrance effects on laminar liquid flow and heat transfer in rectangular microchannels [J].
Gamrat, G ;
Favre-Marinet, M ;
Asendrych, D .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2005, 48 (14) :2943-2954
[9]   A THERMAL MODULE DESIGN FOR ADVANCED PACKAGING [J].
HWANG, LT ;
TURLIK, I ;
REISMAN, A .
JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) :347-355
[10]   Methods for thermal optimization of microchannel heat sinks [J].
Kim, SJ .
HEAT TRANSFER ENGINEERING, 2004, 25 (01) :37-49