A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives

被引：44

作者：

Heo, D ^{[1
]}

Sutono, A ^{[1
]}

Chen, E ^{[1
]}

Suh, Y ^{[1
]}

Laskar, J ^{[1
]}

机构：

[1] Georgia Inst Technol, Packaging Res Ctr, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2001年 / 11卷 / 06期

关键词：

D O I：

10.1109/7260.928928

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present the first demonstration of a CMOS power amplifier (PA) utilizing fully integrated multilayer low-temperature co-fired ceramic (LTCC) high-Q passives for 1.9-GHz digital European cordless telecommunications (DECT) applications. The inductor and capacitor library were built in a multilayer LTCC board using a compact topology, An inductor Q-factor as high as 100 with a self-resonant frequency (SRF) as high as 8 GHz was demonstrated. Measured results of the CMOS-LTCC PA show good agreement with the simulated results exhibiting 48% power added efficiency, 26-dBm output power and 17-dB gain at 1.9 GHz with a 3,3-V drain supply voltage. This result is the first significant step toward a compact DECT transceiver module development utilizing fully integrated multilayer LTCC passives and a standard CMOS technology.

引用

页码：249 / 251

页数：3

共 11 条

[1]

BOPP M, 1999, P IEEE SOL STAT CIRC, P68

[2]

BROWN RL, 1993, J MICROCIRC ELECT PA, V16, P328

[3] A 2.7V DECT RF transceiver with integrated VCO [J].

Dawe, GC ;

Mourant, JW ;

Brokaw, AP .

1997 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE - DIGEST OF TECHNICAL PAPERS, 1997, 40 :308-309

[4]

EYNDE FO, 2000, P IEEE INT SOL STAT, P138

[5]

Gevorgyan S, 1999, IEEE MTT-S, P859, DOI 10.1109/MWSYM.1999.779522

[6]

Heo D, 1999, IEEE MTT-S, P415, DOI 10.1109/MWSYM.1999.779791

[7] LTCC-MLC duplexer for DCS-1800 [J].

Sheen, JW .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999, 47 (09) :1883-1890

[8]

*SONN SOFTW INC, EM US MAN

[9]

STRANGE J, 1997, P IEEE RFIC S DIG, P131

[10] Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications [J].

Sutono, A ;

Pham, A ;

Laskar, J ;

Smith, WR .

1999 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM - DIGEST OF PAPERS, 1999, :175-178

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