Non-Destructive Measurements of Dielectric Constant of Thin dielectric Films with metallic backing using Coplanar transmission line

被引：0

作者：

Kassem, Hussein ^{[1
]}

Vigneras, Valerie ^{[2
]}

机构：

[1] Lebanese Int Univ, EEE Dept, Beirut, Lebanon

[2] Univ Bordeaux Polytech Bordeaux, Lab IMS Bordeaux, Bordeaux, France

来源：

2016 3RD INTERNATIONAL CONFERENCE ON ADVANCES IN COMPUTATIONAL TOOLS FOR ENGINEERING APPLICATIONS (ACTEA) | 2016年

关键词：

dielectric constant; permittivit; conformal mapping; thin films; coplanar transmission line; Non-destructive;

D O I：

暂无

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

This paper introduces a new characterization method of measurement for the permittivity of dielectric material in thin films deposited on metallic/ semiconductor substrate. The method uses the conformal mapping technique to extract the relative permittivity and loss tangent is a non-destructive way. After measuring the S-parameters of the material when placed on a coplanar transmission line, an inverse problem is applied to extract the dielectric constant. The permittivity measurement is done for thin film of 5 micrometer thickness. The obtained results are satisfying and encouraging and the method is validated using standard FEM simulation software.

引用

页码：58 / 61

页数：4