Radiation Response of AlGaN-Channel HEMTs

被引:31
作者
Martinez, M. J. [1 ]
King, M. P. [1 ]
Baca, A. G. [1 ]
Allerman, A. A. [1 ]
Armstrong, A. A. [1 ]
Klein, B. A. [1 ]
Douglas, E. A. [1 ]
Kaplar, R. J. [1 ]
Swanson, S. E. [1 ]
机构
[1] Sandia Natl Labs, Albuquerque, NM 87123 USA
关键词
Aluminum gallium nitride (AlGaN); aluminum nitride (AlN); burnout; displacement damage (DD); heavy ion; high electron mobility transistor (HEMT); failure analysis; gallium nitride (GaN); heavy ions; heavy ion testing; power; proton; radiation effects; radiation effects in devices; radiation-hardness assurance; radiation-hardness assurance testing; semiconductor device breakdown; semiconductor device radiation effects; silicon; single-event burnout (SEB); single-event effects; total ionizing dose (TID); POWER; TRANSISTORS; DEFECTS;
D O I
10.1109/TNS.2018.2885526
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present heavy ion and proton data on AlGaN high-voltage HEMTs showing single event burnout (SEB), total ionizing dose, and displacement damage responses. These are the first such data for materials of this type. Two different designs of the epitaxial structure were tested for SEB. The default layout design showed burnout voltages that decreased rapidly with increasing LET, falling to about 25% of nominal breakdown voltage for ions with LET of about 34 MeV . cm(2)/mg for both structures. Samples of the device structure with lower AlN content were tested with varying gate-drain spacing and revealed an improved robustness to heavy ions, resulting in burnout voltages that did not decrease up to at least 33.9 MeV . cm(2)/mg. Failure analysis showed that there was consistently a point, location random, where gate and drain had been shorted. Oscilloscope traces of terminal voltages and currents during burnout events lend support to the hypothesis that burnout events begin with a heavy ion strike in the vulnerable region between gate and drain. This subsequently initiates a cascade of events resulting in damage that is largely manifested elsewhere in the device. This hypothesis also suggests a path for greatly improving the susceptibility to SEB as development of this technology goes forward. Testing with 2.5-MeV protons showed only minor changes in device characteristics.
引用
收藏
页码:344 / 351
页数:8
相关论文
共 20 条
  • [1] Al0.85Ga0.15N/Al0.70Ga0.30N High Electron Mobility Transistors with Schottky Gates and Large On/Off Current Ratio over Temperature
    Baca, Albert G.
    Klein, Brianna A.
    Allerman, Andrew A.
    Armstrong, Andrew M.
    Douglas, Erica A.
    Stephenson, Chad A.
    Fortune, Torben R.
    Kaplar, Robert J.
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (12) : Q161 - Q165
  • [2] High Temperature Operation of Al0.45Ga0.55N/Al0.30Ga0.70N High Electron Mobility Transistors
    Baca, Albert G.
    Armstrong, Andrew M.
    Allerman, Andrew A.
    Klein, Brianna A.
    Douglas, Erica A.
    Sanchez, Carlos A.
    Fortune, Torben R.
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (11) : S3010 - S3013
  • [3] Bazzoli S., RAD ITS EFFECTS COMP
  • [4] Effects of Applied Bias and High Field Stress on the Radiation Response of GaN/AlGaN HEMTs
    Chen, Jin
    Puzyrev, Yevgeniy S.
    Jiang, Rong
    Zhang, En Xia
    McCurdy, Michael W.
    Fleetwood, Daniel M.
    Schrimpf, Ronald D.
    Pantelides, Sokrates T.
    Arehart, Aaron R.
    Ringel, Steven A.
    Saunier, Paul
    Lee, Cathy
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2015, 62 (06) : 2423 - 2430
  • [5] Proton-Induced Dehydrogenation of Defects in AlGaN/GaN HEMTs
    Chen, Jin
    Puzyrev, Yevgeniy S.
    Zhang, Cher Xuan
    Zhang, En Xia
    McCurdy, Michael W.
    Fleetwood, Daniel M.
    Schrimpf, Ronald D.
    Pantelides, Sokrates T.
    Kaun, Stephen W.
    Kyle, Erin C. H.
    Speck, James S.
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2013, 60 (06) : 4080 - 4086
  • [6] Effects of Proton-Induced Displacement Damage on Gallium Nitride HEMTs in RF Power Amplifier Applications
    Ives, Nathan E.
    Chen, Jin
    Witulski, Arthur F.
    Schrimpf, Ronald D.
    Fleetwood, Daniel M.
    Bruce, Ralph W.
    McCurdy, Michael W.
    Zhang, En Xia
    Massengill, Lloyd W.
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2015, 62 (06) : 2417 - 2422
  • [7] Review-Ultra-Wide-Bandgap AlGaN Power Electronic Devices
    Kaplar, R. J.
    Allerman, A. A.
    Armstrong, A. M.
    Crawford, M. H.
    Dickerson, J. R.
    Fischer, A. J.
    Baca, A. G.
    Douglas, E. A.
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (02) : Q3061 - Q3066
  • [8] Performance and Breakdown Characteristics of Irradiated Vertical Power GaN P-i-N Diodes
    King, M. P.
    Armstrong, A. M.
    Dickerson, J. R.
    Vizkelethy, G.
    Fleming, R. M.
    Campbell, J.
    Wampler, W. R.
    Kizilyalli, I. C.
    Bour, D. P.
    Aktas, O.
    Nie, H.
    Disney, D.
    Wierer, J.
    Allerman, A. A.
    Moseley, M. W.
    Leonard, F.
    Talin, A. A.
    Kaplar, R. J.
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2015, 62 (06) : 2912 - 2918
  • [9] Single-Event Damages Caused by Heavy Ions Observed in AlGaN/GaN HEMTs
    Kuboyama, Satoshi
    Maru, Akifumi
    Shindou, Hiroyuki
    Ikeda, Naomi
    Hirao, Toshio
    Abe, Hiroshi
    Tamura, Takashi
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2011, 58 (06) : 2734 - 2738
  • [10] Mewaldt R., 1988, JPL PUBLICATION, V88-281, P121