Thermoelastic damping in rectangular and circular microplate resonators

被引:118
作者
Li, Pu [1 ]
Fang, Yuming [2 ]
Hu, Rufu [3 ]
机构
[1] Southeast Univ, Sch Mech Engn, Nanjing 211189, Peoples R China
[2] Nanjing Univ Posts & Telecommun, Sch Elect Sci & Engn, Nanjing 210003, Peoples R China
[3] Ningbo Univ Technol, Dept Mech Engn, Ningbo 315016, Zhejiang, Peoples R China
基金
中国国家自然科学基金;
关键词
ENERGY-LOSS MECHANISMS; INTERNAL-FRICTION;
D O I
10.1016/j.jsv.2011.10.005
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
Predicting thermoelastic damping (TED) is crucial in the design of high Q micro-electromechanical systems (MEMS) resonators. In the past, some analytical models have been developed for TED in microbeam resonators. Rectangular and circular microplates are also common elements in many micro-resonators. Two analytical models have been developed for TED in the contour-mode vibration and the out-of-plane vibration of circular microplates, respectively. However, there is lack of works that model the TED in the out-of-plane vibration of rectangular microplates. This paper presents an analytical model for the TED in the fully clamped and simply supported rectangular microplates. The quality factor is found by calculating the energy dissipated per cycle of vibration over the volume of the microplate. The derivation in this paper shows that the model for the TED in the fully clamped and simply supported rectangular plates is the same as the model for the TED in the fully clamped and simply supported circular plates. For the rectangular microplates with other boundary conditions, based on Rayleigh's method, this paper presents a set of analytical approximate models to estimate the TED in the rectangular microplates vibrating in the fundamental mode. The present model is validated by comparison with previously reported model and the FEM model. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:721 / 733
页数:13
相关论文
共 42 条
[1]   Quality factor in trench-refilled polysilicon beam resonators [J].
Abdolvand, Reza ;
Johari, Houri ;
Ho, Gavin K. ;
Erbil, Ahmet ;
Ayazi, Farrokh .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (03) :471-478
[2]   Elasto-Electrostatic Analysis of Circular Microplates Used in Capacitive Micromachined Ultrasonic Transducers [J].
Ahmad, Babar ;
Pratap, Rudra .
IEEE SENSORS JOURNAL, 2010, 10 (11) :1767-1773
[3]  
[Anonymous], PHYS REV B
[4]  
[Anonymous], 1985, Energy and Finite Element Methods in Structural Mechanics
[5]  
[Anonymous], 1969, VIBRATION PLATES
[6]   Elastothermodynamic damping in laminated composites [J].
Bishop, JE ;
Kinra, VK .
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1997, 34 (09) :1075-1092
[7]  
Boley B. A., 1960, Theory of Thermal Stresses
[8]   Impact of geometry on thermoelastic dissipation in micromechanical resonant beams [J].
Candler, Rob N. ;
Duwel, Amy ;
Varghese, Mathew ;
Chandorkar, Saurabh A. ;
Hopcroft, Matthew A. ;
Park, Woo-Tae ;
Kim, Bongsang ;
Yama, Gary ;
Partridge, Aaron ;
Lutz, Markus ;
Kenny, Thomas W. .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (04) :927-934
[9]   Multimode thermoelastic dissipation [J].
Chandorkar, Saurabh A. ;
Candler, Robert N. ;
Duwel, Amy ;
Melamud, Renata ;
Agarwal, Manu ;
Goodson, Kenneth E. ;
Kenny, Thomas W. .
JOURNAL OF APPLIED PHYSICS, 2009, 105 (04)
[10]   Anelasticity and damping of thin aluminum films on silicon substrates [J].
Choi, DH ;
Kim, H ;
Nix, WD .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (02) :230-237