Design and Implementation of a Capacitive-Type Microphone With Rigid Diaphragm and Flexible Spring Using the Two Poly Silicon Micromachining Processes

被引:31
作者
Chan, Chun-Kai [1 ]
Lai, Wei-Cheng [2 ]
Wu, Mingching [3 ]
Wang, Ming-Yung [4 ]
Fang, Weileun [1 ,2 ]
机构
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan
[2] Natl Tsing Hua Univ, Inst NanoEngn & MicroSyst, Hsinchu 30013, Taiwan
[3] Domintech Co Ltd, Taipei 248, Taiwan
[4] Tatung Univ, Taipei 104, Taiwan
关键词
Acoustic transducers; capacitive sensor; MEMS microphone; poly-via; rib-reinforced; rigid diaphragm; silicon condenser microphone; CONDENSER MICROPHONE; POLYSILICON FILMS; THIN-FILMS; FABRICATION; MEMBRANE; DEVICES; DRIE;
D O I
10.1109/JSEN.2011.2121060
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study reports the design and implementation of a novel capacitive-type micromachined microphone. The design of the microphone is based on the well-known two poly-Si layers micromachining processes. The microphone consists of a rigid diaphragm (the 2nd poly-Si layer), flexible springs (the 1st ply-Si layer), and rigid back plate (the 1st poly-Si layer). In short, the proposed microphone design has four merits, (1) the rigid diaphragm acting as the acoustic wave receiver and moving electrode is realized using the rib-reinforced poly-Si layer, (2) the flexible spring acting as the electrical routing as well as supporter for diaphragm is implemented using the thin poly-Si film, (3) the electrical routing of rigid diaphragm (moving electrode) is through the central poly-via and the flexible spring, and (4) the rigid plate acting as the stationary electrodes and back plate is fabricated using the high-aspect-ratio (HARM) trench-refilled poly-Si. To demonstrate the feasibility, the two poly-Si microphone has been implemented and tested. Typical measurement results show that the open-circuit sensitivity of the microphone was 12.63 mV/Pa (-37.97 dBV/Pa) at 1 kHz. (the reference sound-level is 94 dB).
引用
收藏
页码:2365 / 2371
页数:7
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