Microstructure and surface profiling study on the influence of substrate type on sputtered aluminum thin films

被引:2
作者
Mwema, F. M. [1 ,2 ]
Akinlabi, E. T. [1 ]
Oladijo, O. P. [1 ,3 ]
机构
[1] Univ Johannesburg, Dept Mech Engn Sci, Auckland Pk Kingsway, Johannesburg, South Africa
[2] Dedan Kimathi Univ Technol, Dept Mech Engn, Nyeri, Kenya
[3] Botswana Int Univ Sci & Technol, Dept Chem Met & Mat Engn, Palapye, Botswana
关键词
Aluminum thin films; Microstructure; Sputtering; Substrate; Surface roughness; COATINGS;
D O I
10.1016/j.matpr.2020.02.309
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this article, the influence of the type of substrates on properties of aluminum thin films prepared through sputtering technology is presented. The deposition was undertaken at constant substrate temperature of 90 degrees C and RF power of 350W for 2 h on glass and steel substrates. Microstructural properties were analyzed using field emission scanning electron microscopy (FESEM). The optical non-contact surface profiler (OSP) was used to study the topology and roughness characteristics of the films on different substrates. The results show that films grown on mild and stainless-steel substrates exhibited different morphologies and surface topology from those grown on glass substrates, indicating the influence of the substrate type on the deposition, nucleation, growth and film formation of Al thin films. (C) 2019 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the 10th International Conference of Materials Processing and Characterization.
引用
收藏
页码:1496 / 1499
页数:4
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