Dielectric and Thermal Properties of Submicrometric Epoxy/c-BN Composites

被引：0

作者：

Heid, Thomas ^{[1
,2
]}

Frecheffe, Michel ^{[1
]}

David, Eric ^{[2
]}

机构：

[1] Hydro Quebec Res Inst, IREQ, Varennes, PQ J0L 2P0, Canada

[2] Ecole Technol Super, Montreal, PQ, Canada

来源：

2014 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (CEIDP) | 2014年

关键词：

boron nitride; epoxy; dielectric response; polymer composites; thermal conductivity;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, the effect of incorporating submicrometric cubic boron nitride (c-BN) in epoxy resin on the respective thermal conductivities and dielectric responses has been investigated. Epoxy composites with c-BN contents of 1 and 5 wt% have been fabricated and compared to neat epoxy. Broadband Dielectric Spectroscopy (BDS) at several temperatures has revealed only minor increases in real and imaginary parts of the complex permittivity for the 5 wt% c-BN composite, while the thermal conductivity has been improved by more than 25 % compared to neat epoxy. Differential Scanning Calorimetry (DSC) has further been conducted on all samples, showing no major change in the glass transition temperatures after incorporation of c-BN in epoxy.

引用

页码：719 / 722

页数：4

共 7 条

[1]

Haubner R, 2002, STRUCT BOND, V102, P1

[2]

Heid T., IEEE T DIEL IN PRESS

[3]

Heid T., 2014, IEEE EL INS C EIC

[4]

Heid T. F., 2013, IEEE EL INS C EIC

[5]

Kochetov R., 2009, 2009 IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2009), P658, DOI 10.1109/CEIDP.2009.5377801

[6]

Kochetov R., 2010, C EL INS DIEL PHEN C

[7] Development of Epoxy/BN Composites with High Thermal Conductivity and Sufficient Dielectric Breakdown Strength Part I -Sample Preparations and Thermal Conductivity [J].

Wang, Zengbin ;

Iizuka, Tomonori ;

Kozako, Masahiro ;

Ohki, Yoshimichi ;

Tanaka, Toshikatsu .

IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2011, 18 (06) :1963-1972

← 1 →