Investigation of Post Oxidation Annealing Effect on H2O2-Grown-Al2O3/AlGaN/GaN MOSHEMTs

被引:9
作者
Liu, Han-Yin [1 ]
Ou, Wen-Chia [2 ]
Hsu, Wei-Chou [3 ]
机构
[1] Feng Chia Univ, Dept Elect Engn, Taichung 40724, Taiwan
[2] United Microelect Corp, Tainan 74147, Taiwan
[3] Natl Cheng Kung Univ, Dept Elect Engn, Inst Microelect, Tainan 70101, Taiwan
关键词
AlGaN/GaN heterostructure; aluminum oxide (Al2O3); metal-oxide-semiconductor high electron mobility transistor (MOSHEMT); post oxidation annealing (POA); ELECTRON-MOBILITY TRANSISTORS; ALGAN/GAN MOS-HEMT; SURFACE PASSIVATION; GATE OXIDE; TEMPERATURE; LEAKAGE; BREAKDOWN; DIODE;
D O I
10.1109/JEDS.2016.2594293
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper investigates the Al2O3/AlGaN/GaN metal-oxide-semiconductor high electron mobility transistor (MOSHEMT) performance with post oxidation annealing (POA) process. First, the optimum annealing condition was found to be 400 degrees C for 20 min. The transmission electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy were used for material analysis. The hysteresis capacitance-voltage (C-V) measurement was also used to characterize the amount of traps at the Al2O3/AlGaN interface. It was found that the amount of the traps reduced after POA process. In addition, the performance of the MOSHEMT like gate leakage current, output current, subthreshold swing, off-state breakdown voltage, frequency response, and power characteristics were improved after POA process.
引用
收藏
页码:358 / 364
页数:7
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