Mixed signal and SoC design flow requirements

被引：0
|
作者：
Tarim, TB [1 ]
机构：
[1] Texas Instruments Inc, Wireless Analog Technol Ctr, Dallas, TX 75243 USA
来源：
2005 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), VOLS 1-6, CONFERENCE PROCEEDINGS | 2005年
关键词：
design flow; mixed signal; SoC; TLV;
D O I：
10.1109/ISCAS.2005.1466000
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper addresses today's mixed signal and SoC design flow and methodology issues, and discusses the requirements for a successful design flow and methodology from industry point of view. The importance of a strong collaboration between IP owner and customer, maximum re-use, and top level verification (TLV) is discussed in detail. An example is given to emphasize the importance of using behavioral models during TLV to reduce simulation time in large designs.
引用
收藏
页码：5974 / 5977
页数：4
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