Study on novel Ag-Cu-Zn-Sn brazing filler metal bearing Ga

被引:35
作者
Ma, Chaoli [1 ]
Xue, Songbai [1 ]
Wang, Bo [1 ]
机构
[1] Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Jiangsu, Peoples R China
基金
中国国家自然科学基金;
关键词
Silver-based filler metal; Melting temperature; Microstructure; Mechanical properties; MECHANICAL-PROPERTIES; MICROSTRUCTURE; SOLDERS; JOINTS; STEEL; ALLOY;
D O I
10.1016/j.jallcom.2016.07.255
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Novel Ag-Cu-Zn-Sn-Ga brazing filler metals were used for brazing brass and 304 stainless steel. The influence of various content of Ga on the mechanical properties and microstructure of novel Ag-Cu-Zn-Sn filler metals was investigated in this paper. The results shown that wettability, oxidation resistance and mechanical property of Ag-Cu-Zn-Sn filler metals were improved significantly with addition of Ga. In addition, wetting ring was found on the front edge of the melted brazing alloy which consisted with silver-based solid solution, copper-based solid solution. Moreover, the 17AgCuZnSn-xGa filler metals displayed finer and more uniform microstructures when appropriate Ga was added, which gamma-Cu5Zn8 was disappeared when Ga content was at about 2 wt%. The results also indicated that the shear strength of the joints of brass/stainless steel brazed with 17AgCuZnSn-2Ga filler metal was 36.9% higher than the shear strength of the 17AgCuZnSn filler metal, which presented that the addition of Ga not only can improve the wetting property, but also can enhance mechanical properties of the brazing joint. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:854 / 862
页数:9
相关论文
共 24 条
[1]  
[Anonymous], 2011, 275522011 GBT
[2]  
[Anonymous], 2008, 113642008 GBT
[3]   Effect of Silver Content on Microstructure and Properties of Brass/steel Induction Brazing Joint Using Ag-Cu-Zn-Sn Filler Metal [J].
Cao, J. ;
Zhang, L. X. ;
Wang, H. Q. ;
Wu, L. Z. ;
Feng, J. C. .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 27 (04) :377-381
[4]  
Chen WengXue, 2010, MATER DESIGN, V31, P200
[5]   Effects of rare earth Ce on properties of Sn-9Zn lead-free solder [J].
Chen, WenXue ;
Xue, Songbai ;
Wang, Hui ;
Hu, Yua ;
Wang, Jianxin .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 21 (07) :719-725
[6]  
Feng J., 2012, Mater. Des, DOI [10.1016/j.matdes.2012.05.028, DOI 10.1016/J.MATDES.2012.05.028]
[7]  
GB/T, 2008, 113632008 GBT
[8]   Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology [J].
Han Zong-jie ;
Xue Song-bai ;
Wang Jan-xin ;
Zhang Xin ;
Zhang Liang ;
Yu Sheng-lin ;
Wang Hui .
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2008, 18 (04) :814-818
[9]  
Lai ZM, 2010, RARE METAL MAT ENG, V39, P397, DOI 10.1016/S1875-5372(10)60087-2
[10]  
Lai Zhongmin, 2009, China Welding, V18, P33